Resin formulation

Details Resin formulation Resin formulation

C - Chemistry, Metallurgy

08

L

C08L 63/00 (2006.01) B29C 45/57 (2006.01) C08K 3/36 (2006.01) C08L 29/14 (2006.01) C08L 77/00 (2006.01) C08L 101/00 (2006.01)

Patent

CA 2078603

Resin Formulation Abstract of Disclosure The present invention provides an epoxy resin composition comprising an epoxy resin, at least one filler, a thixotropic agent in an amount less than that necessary to impart thixotropic properties and a polymer which dissolves in and thickens a mixture of the resin and a curing agent therefor when the mixture is heated prior to curing. The compositions are used for making moulded articles.

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