Resin impregnated laminate for wiring board applications

Details Resin impregnated laminate for wiring board applications Resin impregnated laminate for wiring board applications

D - Textiles, Paper

21

H

D21H 13/26 (2006.01) B32B 27/04 (2006.01) D04H 1/42 (2006.01) H05K 1/03 (2006.01)

Patent

CA 2159182

Dimensionally stable resin impregnated laminates for printed wiring board applications are reinforced with from 43 to 57 weight percent of nonwoven aramid sheet having a coefficient of thermal expansion of less than 10 ppm per °C, a basis weight of from 0.8 to 4.0 oz/yd2, a density of from 0.5 to 1.0 g/cc and a Gurley Hill Porosity of less than 10 sec.

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