Resin material for inserting lead frame and molded component...

C - Chemistry – Metallurgy – 08 – L

Patent

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Details

400/3076, 18/63

C08L 81/04 (2006.01) H01L 23/29 (2006.01) H05K 1/05 (2006.01)

Patent

CA 2032962

Abstract A resin material for inserting a lead frame comprises: (A) 100 parts by weight of a polyarylene sulfide resin, (B) 0.1 to 30 parts by weight of an .alpha.-olefin copolymer graft-copolymerized with an unsaturated carboxylic acid or its anhydride, and (C) 10 to 300 parts by weight of a fibrous filler, a nonfibrous inorganic filler or a mixture thereof.

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