Resin mixture

C - Chemistry – Metallurgy – 08 – G

Patent

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C08G 18/58 (2006.01) C08F 283/10 (2006.01) C08G 18/00 (2006.01) C08G 18/04 (2006.01) C08G 18/78 (2006.01) C08G 59/40 (2006.01) H01B 3/40 (2006.01) H02K 3/30 (2006.01)

Patent

CA 1156396

ABSTRACT OF THE DISCLOSURE A thermosetting, solvent free resin mixture, more particularly for use as a highly heat resistant impregnating, steeping and casting resin for the insulation of electrical conductors and windings in electrical machines and apparatus, contains at least one reactive, liquid epoxide compound, at least one reactive, liquid polyisocyanate, and at least one latent hardener for these components; the said mixture also contains triallyl cyanurate as a cross-linking agent.

372194

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