Resin molded article for chamber liner

Details Resin molded article for chamber liner Resin molded article for chamber liner

H - Electricity

01

L

H01L 21/00 (2006.01) H01L 21/3065 (2006.01)

Patent

CA 2330050

A resin molded article for fitting to an inside wall of a liner in a chamber of a dry etching apparatus used in semiconductor manufacture is disclosed. The resin molded article is a seamless annular molded article having a heat resistance temperature of at least 100 ~C, a tensile elongation at break of at least 0.3 %, a flexural modulus of at least 10,000 kg/cm2, an outside diameter from 0 to 0.3 % larger than the inside diameter of the liner, and a wall thickness of not more than 2 mm.

Cet article en résine moulée vient s'adapter sur la paroi intérieure du chemisage d'une chambre d'un appareil de gravure au plasma utilisé pour la fabrication de semi-conducteurs. L'article en résine moulée est un article annulaire moulé sans joint se caractérisant par un point de thermotolérance d'au moins 100 ·C, un coefficient de rupture à la traction d'au moins 0,3 %, un module d'élasticité en flexion d'au moins 10.000 kg/cm?2¿, un diamètre extérieur de 0 % à 0,3 % plus grand que le diamètre intérieur du chemisage, et une épaisseur de paroi n'excédant pas 2 mm.

Affiliated with

Also associated with

Rating

Resin molded article for chamber liner does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Resin molded article for chamber liner, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Resin molded article for chamber liner will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1490688