C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/7824, 400/78
C08L 77/06 (2006.01) C08K 3/00 (2006.01) C23C 28/02 (2006.01) C25D 5/56 (2006.01) H05K 1/03 (2006.01) H05K 9/00 (2006.01)
Patent
CA 2020606
The resin composition for forming plated layer disclosed herein comprises a polyamide composed of a dicarboxylic acid component recuring unit and a recurring unit derived from a diamine component unit having an alkylene group of 4 to 25 carbon atoms and at least one inorganic filler. There are also disclosed the resin molded article having plated layer formed thereon, the electromagnetic wave shielding material, the decorative resin molded article and the connecting material produced by forming plated layer on the surfaces of the resin molded articles formed from said resin composition. Further, there is disclosed the printed circuit board produced by forming selectively metallized layer in wiring circuit portion on the surface of the resin molded article formed from said resin composition and the method for plating to form these articles having the layer plated thereon.
La composition de résine pour couche de plaquage de l'invention renferme un polyamide constitué d'un acide dicarboxylique comme unité séquentielle, et d'une autre unité séquentielle, dérivée d'une diamine, comportant un groupe alkylène de 4 à 25 atomes de carbone, et au moins une charge minérale. L'invention présente un article en résine moulée, portant la couche de plaquage, la matière protégeant contre les ondes électromagnétiques, un article décoratif en résine moulée, et la matière de connexion, produite en appliquant la couche de plaquage sur les surfaces des articles moulés à partir de cette composition. Enfin, l'invention présente la plaque de circuit imprimé, produite en disposant une couche métallisée sélectivement dans la partie du circuit de câblage à la surface de l'article en résine moulée à partir de la composition; méthode de plaquage pour fabriquer ces articles ainsi plaqués.
Ikejiri Fumitoshi
Kawamoto Keiji
Yamamoto Sanehiro
Mitsui Chemicals Inc.
Smart & Biggar
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