C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
C08L 77/00 (2006.01) C08K 3/08 (2006.01) C08K 3/10 (2006.01)
Patent
CA 2426631
A lead-free molded resin for radiation shielding which is obtained by melt- molding into a plate form a thermoplastic resin composition comprising a polyamide resin and tungsten particles, characterized in that the tungsten particles comprise at least 95 wt.% tungsten metal.
Cette invention concerne une résine moulée, sans plomb, utilisée comme écran anti-radiations et obtenue par moulage. Cette composition de résine thermoplastique moulée par fusion dans une forme plate comprend une résine polyamide et des particules de tungstène représentant au moins 95 % en poids de métal tungstène.
Kanebo Limited
Kanebo Gohsen Limited
Mitsubishi Chemical Corporation
Smart & Biggar
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