H - Electricity – 01 – L
Patent
H - Electricity
01
L
117/104
H01L 23/31 (2006.01) H01L 21/56 (2006.01) H01L 23/29 (2006.01)
Patent
CA 1206819
- 1 - Abstract: The invention provides a process for manufacturing a semiconductor device and the semiconductor device so produced. In particular, the process permits a semiconductor pellet to be sealed in an epoxy resin in a manner that does not require the use of a mold. The epoxy resin is dropped onto the pellet as the pellet is turned. The epoxy resin its then heated at 160-180°C for 2 to 10 minutes as the pellet is turned, so that the surface portions of the epoxy resin are hardened. The resin is then heated at 160-200°C for 3 to 24 hours while the pellet is kept stationary in order to complete the hardening of the resin. The avoidance of the use of a mold means that a very satisfactory device can be mass produced quickly and efficiently.
443800
Fujieda Sadao
Fukuhara Toshiaki
Hidaka Toshiyuki
Misawa Yutaka
Sakamoto Hisashi
Hitachi Ltd.
Kirby Eades Gale Baker
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