Resin-molding die

Details Resin-molding die Resin-molding die

B - Operations, Transporting

29

C

B29C 45/14 (2006.01)

Patent

CA 2328687

A resin-molding die for embedding in a molded resin a plurality of bus bars connected with each other via a bridge portion includes a supporting member formed on a first mold, for supporting the bus bars, a pin-receiving hole formed in the supporting member at a position associated with the bridge portion, and a pin provided on a second mold at the position associated with the bridge portion and the pin-receiving hole, for cutting and raising the bridge portion substantially at an intermediate part thereof.

Affiliated with

Also associated with

Rating

Resin-molding die does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Resin-molding die, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Resin-molding die will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1551708