Resinous composition

C - Chemistry – Metallurgy – 08 – L

Patent

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400/3070, 400/58

C08L 77/02 (2006.01) C08L 51/04 (2006.01) C08L 77/00 (2006.01) C08L 77/06 (2006.01) C08L 77/10 (2006.01)

Patent

CA 1266935

ABSTRACT OF THE DISCLOSURE A resinous composition, having excellent toughness, flexibility, heat resistance and moldability, comprises (A) from 5 to 98% by weight of a polyamide and (B) from 95 to 2% by weight of a polyolefin modified with from 0.001 to 10% by mole based on all of the polymer components of a component having at least one functional group selected from the groups represented by the following general formulas (I), (II) and (III); (I) Image (II) (III) wherein R' represents H or -CH3; and R1, R2, R3, R4 and R5 are each independently selected from benzyl, phenyl, alkyl having 1 to 4 carbon atoms, or a group of the formula Image in which n is an integer of 2 to 10. The resulting compositions have excellent toughness, flexibility, heat resistance and moldability.

456438

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