Resinous die

Details Resinous die Resinous die

B - Operations, Transporting

30

B

B30B 15/02 (2006.01) B21D 37/20 (2006.01)

Patent

CA 2315356

A resinous die for press-shaping a blank material into a desired configuration, which comprises a die member and a mating punch, both having respective shaping portions. Each shaping portion is formed of an epoxy resin layer provided at portions thereof where a relatively low surface pressure is applied, and a plurality of reinforcing pieces provided in an embedded fashion at portions thereof where a relatively high surface pressure is applied, for reinforcing the shaping portion. This arrangement imparts increased durability to the shaping portion and hence the die while keeping the cost of manufacture of the die to a minimum.

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