C - Chemistry – Metallurgy – 25 – D
Patent
C - Chemistry, Metallurgy
25
D
356/19
C25D 5/02 (2006.01) B05D 1/32 (2006.01) C23C 28/00 (2006.01) H05K 3/10 (2006.01) H05K 3/18 (2006.01) H05K 3/42 (2006.01) H05K 3/06 (2006.01)
Patent
CA 1278877
ABSTRACT OF THE DISCLOSURE Printed circuit boards containing thru-holes requiring metallization are manufactured by first applying to the board material an alkaline strippable resist in a predetermined desired pattern, thereafter applying material catalytic to subsequent metallization, thereafter treating the board with an aqueous alkaline solution to remove catalytic material from resist surfaces without adversely affecting the catalyst at non-resist areas, and then metallizing the non-resist areas. The ability to preliminarily apply the resist pattern before catalyst application, metallization, etc., yet prevent metallization of the resist, enables the manufacturing process to proceed straight through the activation, metallization, etc. steps without need for interruption for resist application.
541745
Kukanskis Peter E.
Rhodenizer Harold
Macdermid Incorporated
Perley-Robertson Hill & Mcdougall Llp
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