Resist ink composition

Details Resist ink composition Resist ink composition

G - Physics

03

F

G03F 7/038 (2006.01) C08G 65/10 (2006.01) C08G 65/18 (2006.01) C08G 65/22 (2006.01) H05K 3/28 (2006.01)

Patent

CA 2385253

The present invention provides a resist ink composition comprising a compound (a) having at least one oxetanyl group and at least one epoxy group within the same molecule and a compound (b) capable of initiating cationic polymerization under irradiation by an active energy ray and/or under heat. This resist ink composition has high photosensitivity and enables the final curing by a brief heating and the cured film exhibits good physical properties.

La présente invention concerne une composition d'encre de réserve comprenant un composé (a) qui comporte un au moins un groupe oxétanyle et au moins un groupe époxy dans la même molécule, et un composé (b) capable de déclencher une polymérisation cationique lorsqu'il est irradié par un rayon d'énergie active et/ou de la chaleur. Cette composition d'encre de réserve se caractérise par une photosensibilité élevée et un durcissement final obtenue après un rapide chauffage, le film durci possédant de bonnes propriétés physiques.

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