Resist pattern, process for the information of the same, and...

Details Resist pattern, process for the information of the same, and... Resist pattern, process for the information of the same, and...

H - Electricity

01

L

H01L 29/00 (2006.01) H01L 21/02 (2006.01) H01L 21/027 (2006.01) H05K 3/04 (2006.01) H05K 3/10 (2006.01) G03F 7/00 (2006.01)

Patent

CA 2288458

A process for the formation of a wiring pattern, which includes the steps of: exposing a resist through a photomask, the photomask having a pattern whose line width is equal to or less than a resolution limit; and developing the exposed resist to form a resist pattern having groove depressions on the surface thereof, the depressions not reaching the back of the resist pattern. The resist may be a positive resist in which case the resist pattern is formed on an underplate feed film; a plating metal is precipitated on the feed film in a region not covered by the resist pattern; the resist pattern is stripped after the precipitation; and the feed film is selectively removed in a region not covered by the plating metal. Alternatively, the resist may be a negative resist in which case the resist pattern is formed on a substrate; a metallic material is deposited on the resist pattern and the substrate; and the resist is stripped from the substrate to remove the overlying metallic material.

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