C - Chemistry – Metallurgy – 25 – D
Patent
C - Chemistry, Metallurgy
25
D
C25D 3/04 (2006.01) H01C 7/00 (2006.01) H01C 17/06 (2006.01) H05K 1/09 (2006.01) H05K 1/16 (2006.01) H05K 3/06 (2006.01) H05K 3/02 (2006.01)
Patent
CA 2076738
FL-102-200(CIP) RESISTIVE METAL LAYERS AND METHOD FOR MAKING SAME ABSTRACT OF THE DISCLOSURE Electrodeposited planar resistive layers are disclosed, which may be combined with conductive layers and insulative layers to produce laminates useful in the preparation of printed circuit boards. The resistive layers are prepared by electroplating from an electroplating bath containing a source of a normally conductive metal component and a source of a non-metallic resistance increasing additive. Planar resistors may be produced which have sheet resistances in the range of from about 15 to about 1000 .OMEGA. per square.
Clouser Sidney J.
Lee Chinho
Prokop Mary K.
Whewell Christopher J.
Clouser Sidney J.
Gould Electronics Inc.
Gould Inc.
Lee Chinho
Prokop Mary K.
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