B - Operations – Transporting – 23 – K
Patent
B - Operations, Transporting
23
K
113/87, 113/94
B23K 1/00 (2006.01) B23K 1/018 (2006.01) H05K 13/04 (2006.01)
Patent
CA 1196820
RESOLDERING TOOL FOR CERAMIC SUBSTRATE HYBRID ELECTRONIC CIRCUITS Abstract of the Disclosure A reworking tool for ceramic substrate hybrid circuits has a metal base for sitting on a heated surface, a support member support above the base and a pillar of heat conductive material attached to the base and extending up through an aperture in the support member. The top surfaces of pillar and support member are in a common plane. By this means a "hot spot" is produced at the top of the pillar and a hybrid circuit positioned on the support member can be so positioned that a particular component position is resting on the top of the pillar. Solder at this component position will melt and a component can be removed, or a component added or a component removed and another placed in position. Lateral sliding of the hybrid circuit laterally on the support member enables the solder to solidify.
426177
Jelly Sidney Thomas
Nortel Networks Limited
LandOfFree
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