Resole resin binder composition

Details Resole resin binder composition Resole resin binder composition

C - Chemistry, Metallurgy

08

G

154/141, 402/40,

C08G 8/08 (2006.01) B32B 27/04 (2006.01) C08G 8/04 (2006.01) C08K 5/098 (2006.01)

Patent

CA 1098247

ABSTRACT OF THE DISCLOSURE The invention relates to a resin binder composition comprising, in combination, a resole resin and a metal salt curing accelerator providing a binder composition that has an improved cure rate in electrical grade lamin- ates without adversely affecting electrical properties. The binder composition provides low viscosity for im- pregnation accelerated curing rates for advancing the impregnated substrate prior to laminating and final curing.

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