Resonator for ultrasonic wire bonding

Details Resonator for ultrasonic wire bonding Resonator for ultrasonic wire bonding

B - Operations, Transporting

23

K

B23K 20/10 (2006.01) H01L 21/00 (2006.01)

Patent

CA 2392460

The bonding position between a bonding wire and an electrode is maintained accurately, an ultrasonic horn is mounted to a bonding machine by the attachment portions of support portions situated at minimum vibration amplitude points equally distant from a capillary in opposite directions in such a manner that it is supported on both sides, and the ultrasonic horn, capillary and bonding work portion are vibrated by ultrasonic waves to bond the end portion of the bonding wire.

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