Reworkable thermosetting resin compositions

Details Reworkable thermosetting resin compositions Reworkable thermosetting resin compositions

C - Chemistry, Metallurgy

08

G

C08G 59/24 (2006.01) C08L 63/00 (2006.01) H01L 21/56 (2006.01)

Patent

CA 2331790

This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages ("CSPs"), ball grid arrays ("BGAs"), and the like, each of which having a semiconductor chip, such as large scale integration ("LSI"), on a carrier substrate. The compositions of this invention are reworkable when subjected to appropriate conditions.

L'invention concerne des compositions de résine thermodurcissables servant à monter sur des cartes de circuits imprimés des dispositifs semi-conducteurs tels que des ensembles de la taille ou à échelle d'une puce (<=CSPs>=), des grilles matricielles à billes (<=BGAs>=), ou autres dispositifs semblables, possédant chacun une puce de semi-conducteur, par exemple à intégration à grande échelle (<=LSI>=), sur un substrat de support. Les compositions de l'invention sont remaniables lorsqu'elles sont soumises à des conditions appropriées.

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