Rf sputtering apparatus including multi-network power supply

H - Electricity – 05 – H

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204/167, 356/192

H05H 1/46 (2006.01) H01J 37/34 (2006.01) H03H 7/38 (2006.01)

Patent

CA 1143005

ABSTRACT For use in sputtering from one or more large area targets, as large as 50 cm2 to several square meters, a power transfer network includes an inductive element capable of being tapped along its length, such as a linear line section and a tuning capacitor with the source of high frequency energy in the megahertz range, each of the source and the electrode system being connectively tapped into a suitable location along the inductive element. A string of at least three resonant networks is arranged between the high frequency r.f. source and the sputtering electrodes and these networks transform impedance and voltage from one end of the string at the source to different values and conditions at the other end of the string where they are tied to the electrodes in order to achieve a maximum of overall power transfer efficiency.

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