Rfid transponder structure optimized for in-line label...

Details Rfid transponder structure optimized for in-line label... Rfid transponder structure optimized for in-line label...

G - Physics

01

V

G01V 15/00 (2006.01)

Patent

CA 2528797

The invention provides a method of manufacturing RFID transponders for attachment to packages that will be in transit or to packages containing, for example, medicinal preparations, when information respecting the handling of the packages or the timing of removal of the medicinal preparations is required. The method utilizes a continuous strip of adhesive backed material, such as an adhesive tape supplied on a roll. As the tape is removed from the roll an anti-adhesive material is applied to predetermined areas of the adhesive surface to render such areas non-adhesive. A conductive ink is coated to the non-adhesive areas to create spaced apart antenna pads. An RFID chip strap, carrying an RFID chip, and having corresponding spaced apart conductive pads is applied to the tape with the conductive pads thereof contacting the antenna pads. The strap is secured to the tape through contact with the adhesive surrounding the antenna pads. Completed transponders can be severed from the tape and applied via the adhesive thereon to the package as desired.

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