Ringfield lithography

G - Physics – 02 – B

Patent

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Details

G02B 17/00 (2006.01) G02B 17/06 (2006.01) G03F 7/20 (2006.01)

Patent

CA 2052734

Ringfield projection apparatus using x-ray radiation e.g. of 1.30 .ANG. wavelength is suitable for lithographic patterning in the fabrication of integrated circuits at design rules of 0.25 µm and below. The design permits reduction from an enlarged mask as well as substantial throughput, the latter due to unexpectedly large slit width,Incorporation of a folding mirror improves fabrication expediency by moving the device being fabricated to the other side of the system from the mask.

L'invention est un appareil de projection à champ annulaire utilisant des rayons X d'une longueur d'onde de 1,30 angström pour la fabrication de circuits intégrés par lithographie avec vérification des règles de conception à 0,25 m ou mieux. Ceci permet de réduire l'étendue du masque tout en obtenant un débit substantiel, celui-ci résultant d'une largeur de fente exceptionnelle. L'utilisation d'un miroir pliant incorporé accélère la fabrication en transportant le dispositif en cours de fabrication de l'autre côté du système par rapport au masque.

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