Robust interconnect structure

Details Robust interconnect structure Robust interconnect structure

H - Electricity

01

L

H01L 23/485 (2006.01) H01L 21/60 (2006.01) H01L 23/532 (2006.01)

Patent

CA 2368950

A structure comprising a layer of copper (1), a barrier layer (10), a layer of AlCu (9), and a pad-limiting layer (7), wherein the layer of AlCu and barrier layer are interposed between the layer of copper and pad-limiting layer.

L'invention porte sur une structure comprenant une couche de cuivre (1), une couche (10) barrière, une couche d'AlCu (9) et une couche (7) de délimitation des plots. La couche d'AlCu et la couche barrière sont placées entre la couche de cuivre et la couche de délimitation des plots.

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