H - Electricity – 01 – L
Patent
H - Electricity
01
L
356/138
H01L 29/06 (2006.01) C30B 33/00 (2006.01) H01L 21/18 (2006.01) H01L 21/304 (2006.01) H01L 21/70 (2006.01) H01L 23/12 (2006.01)
Patent
CA 2001934
ABSTRACT OF THE DISCLOSURE A rod base material for forming wafers for electronic devices is formed from a plurality of rod members made of selected materials. The rods are assembled in parallel and are bonded with each other into an integrated body. In one aspect of this invention, a mirror-finished bonding face is formed at the outer surface of each of the rod members, and is cleaned by a surface treatment using chemicals. Subsequently, respective rod members are assembled in parallel and brought into contact with each other at their respective bonding faces. The thus prepared and assembled rod members are maintained in a heated atmosphere until they combine into an integrated body to provide the base material. The rod base material is thereafter subjected to slicing to provide wafers used for forming electronic devices. Since the rod base material has a structure in which a plurality of the rod members are assembled in parallel and bonded with each other into an integrated body, the overall diameter of the rod base material can be significantly large compared to the diameter of individual rods. Accordingly, the diameter of wafers obtained by slicing such rod base material is also increased remarkably, and the cost per electronic device formed on the wafer is correspondingly reduced.
Mitsubishi Denki Kabushiki Kaisha
R. William Wray & Associates
LandOfFree
Rod assembly for manufacturing large wafers for electronic... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Rod assembly for manufacturing large wafers for electronic..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Rod assembly for manufacturing large wafers for electronic... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1546797