Room temperature bonding machine and room temperature...

B - Operations – Transporting – 23 – K

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Details

B23K 20/00 (2006.01) B81C 3/00 (2006.01) H01L 21/02 (2006.01)

Patent

CA 2711227

A room temperature bonding machine is provided with an evacuation apparatus, a gas supply apparatus, a pressure gauge, a cleaner apparatus, a pressure controller and a pressing mechanism. The evacuation apparatus evacuates gas from the chamber. The gas supply apparatus supplies introduction gas into the chamber. The pressure gauge measures the pressure in the chamber. The cleaner apparatus cleans first and second substrates in the chamber when said pressure is at a predetermined degree of vacuum. The pressure controller controls both of the evacuation apparatus and the gas supply apparatus so that the pressure is regulated to a target pressure. The pressing mechanism presses and bonds the first and second substrates when the pressure is set to said target pressure.

L'invention porte sur un appareil de jointement à froid qui comporte un dispositif de refoulement, un dispositif d'alimentation en gaz, un manomètre, un dispositif de clarification, un régulateur de pression et un mécanisme de compression. Le dispositif de refoulement évacue un gaz depuis l'intérieur d'une chambre. Le dispositif d'alimentation en gaz alimente en gaz d'introduction l'intérieur de la chambre. Le manomètre mesure la pression dans la chambre. Le dispositif de clarification clarifie une première plaque et une seconde plaque dans la chambre lorsque la pression mesurée est à un degré de vide prédéterminé. Le régulateur de pression commande à la fois le dispositif de refoulement et le dispositif d'alimentation en gaz de telle sorte que la pression mesurée peut être égale à une pression cible. Le mécanisme de compression presse la première plaque et la seconde plaque dans la chambre lorsque la pression mesurée est cette pression cible.

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