Room-temperature curable epoxy resin composition

Details Room-temperature curable epoxy resin composition Room-temperature curable epoxy resin composition

C - Chemistry, Metallurgy

08

F

C08F 230/08 (2006.01) C08F 8/08 (2006.01) C08F 8/12 (2006.01) C08F 8/42 (2006.01) C08L 43/04 (2006.01) C08L 63/10 (2006.01)

Patent

CA 2082215

A room-temperature curable epoxy resin composition is disclosed. The composition contains (a) a resin component containing a polyepoxide function and an alkoxysilyl function, and (b) as a curing catalyst an amine, amide or urea salt of a superacid. The composition find its use in coating compositions, adhesives, sealants or potting compounds and casting compositions.

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