C - Chemistry – Metallurgy – 08 – K
Patent
C - Chemistry, Metallurgy
08
K
402/17
C08K 5/54 (2006.01) C08K 5/544 (2006.01) C08L 83/04 (2006.01)
Patent
CA 1311329
ABSTRACT OF THE DISCLOSURE A room temperature-curing organopolysiloxane composition which has improved adhesive properties after immersion in hot water contains a polydiorganopolysiloxane endblocked with hydroxyl or alkoxy, a disilaalkane of the formula Image such as 1,2-bis(trimethoxysilyl)ethane, and a reaction mixture of an aminoalkylalkoxysilane such as gamma- aminopropyltrimethoxysilane, and an epoxyalkylalkoxysilane such as gamma-glycidoxypropyltrimethoxysilane. The composition can also can contain a curing catalyst, a filler, and other alkoxysilanes. The substrates which exhibit improved adhesion include glass, metal and plastics.
575941
Fukayama Miyoji
Hirashima Hiroshi
Dow Corning Toray Silicone Company Limited
Gowling Lafleur Henderson Llp
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