Rotary electroplating of spaced conductive areas

Details Rotary electroplating of spaced conductive areas Rotary electroplating of spaced conductive areas

C - Chemistry, Metallurgy

25

C

204/153, 204/66

C25C 7/00 (2006.01) C25C 5/02 (2006.01) C25C 7/08 (2006.01)

Patent

CA 1306440

ABSTRACT OF THE DISCLOSURE Metal is deposited by electrolysis from an electrolyte using a device comprising an electrolysis cell, at least one anode and at least one plate-shaped cathode. The cathode is rotatable and comprises a metal plate substrate coated with an electrically insulating material having at least one opening to expose the metal substrate to the electrolyte. The opening has such a cross- sectional dimension that a powder-like deposit of the metal of greater area than the opening is formed and the greater area of the deposited metal acts to reduce the electric current density, whereby a subsequently deposited portion of the metal has a solid consistency. The deposited metal can be easily stripped off either continuously or intermittently above the surface of the electrolyte.

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