Round solder pad for surface mounting electronic devices and...

Details Round solder pad for surface mounting electronic devices and... Round solder pad for surface mounting electronic devices and...

H - Electricity

05

K

356/11

H05K 1/18 (2006.01) H05K 1/11 (2006.01) H05K 3/34 (2006.01)

Patent

CA 1255014

A ROUND SOLDER PAD FOR SURFACE MOUNTING ELECTRONIC DEVICES AND A SURFACE MOUNTING POSITION INCORPORATING SUCH SHAPED PADS Astract of the Disclosure Solder pads for the surface mounting of devices on a circuit board are given a round shape of predetermined size, By such shaping of a solder pad, or contact pad, a device will be held in, or moved to, a desired position on the melting of the solder at the pad. Improved alignment and positioning is obtained. - i -

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