Rubber-modified epoxy adhesive compositions

Details Rubber-modified epoxy adhesive compositions Rubber-modified epoxy adhesive compositions

C - Chemistry, Metallurgy

09

J

400/4508, 154/10

C09J 163/00 (2006.01) C08G 59/50 (2006.01) C08G 59/56 (2006.01) C08G 59/58 (2006.01) C09J 109/02 (2006.01) C09J 133/06 (2006.01) C09J 179/00 (2006.01)

Patent

CA 1302604

ABSTRACT OF THE DISCLOSURE An epoxy adhesive composition for the bonding of SMC to metal substrates and other SMC parts having an improved cure rate and hence rate of initial lap shear strength development has been discovered. The adhesive composition comprises an epoxy resin and a polyacrylate or polymethacrylate cured with a combination of an amine-functional butadiene-acrylonitrile rubber, at least one aliphatic or aromatic polyamine and at least one polyamide.

570255

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