C - Chemistry – Metallurgy – 08 – F
Patent
C - Chemistry, Metallurgy
08
F
18/149, 117/190,
C08F 279/02 (2006.01) B32B 17/04 (2006.01) C08F 265/04 (2006.01) C08J 5/08 (2006.01) C08L 51/04 (2006.01) C09J 151/00 (2006.01)
Patent
CA 1171194
Abstract of the Disclosure An aqueous alkaline dispersion of a rubbery graft or over polymerized copolymer of a diene and a vinyl pyridine on n polyacrylate seed (core or substrate), said acrylate polymer having a Tg of not above about -20°C, desirably also containing a polybutadiene, and a water soluble, heat reactable phenolic resin in certain amounts is useful in forming an adhesive for bonding glass fiber reinforcing elements or cords to rubber compounds or stocks. After dipping the glass fiber cord in the one-step adhesive dip, the coated cord is heated to dry it and heat cure or heat set the adhesive on the cord. Thereafter, the adhesive containing glass fiber cord is combined or laminated (calendered) with a curable rubber compound and the resulting assembly is cured to form a composite in which the glass fiber cord is bonded to the rubber by means of said adhesive.
393625
Omnova Solutions Inc.
Smart & Biggar
LandOfFree
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