Ruggedized multi-layer printed circuit board based downhole...

G - Physics – 01 – V

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

G01V 3/30 (2006.01) E21B 47/02 (2006.01) H01Q 1/04 (2006.01)

Patent

CA 2693270

A method is provided which comprises drilling a borehole using a bottomhole assembly comprising an electromagnetic wave resistivity measuring tool, and performing azimuthally sensitive resistivity readings of a formation surrounding the borehole using the electromagnetic wave resistivity tool while drilling. Performing the azimuthally sensitive readings of the formation may further comprise imaging the borehole. As well, a method is provided which comprises imaging a borehole using an electromagnetic radiation based resistivity tool.

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

Ruggedized multi-layer printed circuit board based downhole... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Ruggedized multi-layer printed circuit board based downhole..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ruggedized multi-layer printed circuit board based downhole... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-1684657

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.