Screen-printable solder mask composition for circuit boards

C - Chemistry – Metallurgy – 08 – K

Patent

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Details

356/12, 31/163,

C08K 3/36 (2006.01) B23K 35/22 (2006.01) H05K 3/28 (2006.01)

Patent

CA 1133158

Abstract Screen-printing composition containing an epoxy novolac, a phenoxy polymer, a liquid anhydride, colloidal silica, and a diluent. The composition is useful for coating substrates such as printed circuits and serves as a solder mask.

333040

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