Sealable packaging structures and applications related thereto

B - Operations – Transporting – 32 – B

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

B32B 27/32 (2006.01) B32B 27/08 (2006.01)

Patent

CA 2625996

Heat-sealable, multi-layer composite packaging structures that are suitable for packaging and having improved sealing properties and simplified construction as compared to prior art composite film constructions are disclosed. The inventive film structure includes a first substrate, such as paper, bonded such as by extrusion lamination, to a sealable, high-barrier film including in this order : (1) a core layer comprising from about 5 wt% to about 40 wt % of a first polymer wherein the first polymer includes a density in the range of 0,850g/cm3 to 0,920 gfcm3, a DSC melting point in the range of 40~c to 160~c, and a melt flow rate in the range of 2 dg/min to 100 dg/min; (2) a tie layer comprising said first polymer; and (3) a sealant layer, the tie layer being on a side of the core layer opposite the first substrate. This inventive "paper-adhesive- polymer" lamination may replace prior art "paper- adhesive-foil-adhesive" foil- based tandem laminations. An improved or comparable polymer film substrate may replace the "foil-adhesive" layer components of the popular incumbent prior art structure.

L'invention concerne des structures d'emballage pouvant être scellées par chaleur, multicouche, composites et conçues pour l'emballage et possédant des propriétés de scellement améliorées et une construction simplifiée comparativement à des constructions de films composites de l'art antérieur. La structure de films selon l'invention comprend un premier substrat, tel que du papier, lié par extrusion-laminage, à un film à haute barrière scellable comprenant dans cet ordre: (1) une couche centrale comprenant entre environ 5 % en poids et environ 40 % en poids d'un premier polymère, celui-ci comprenant une densité comprise dans la gamme allant de 0,850g/cm3 à 0,920 gf cm3, un point de fusion DSC compris dans la gamme allant de 40°c à 160°c et un débit de fluidité à chaud compris entre 2 dg/min et 100 dg/min; (2) une couche de fixation comprenant ce premier polymère; et (3) une couche de scellement, la couche de fixation se trouvant sur un côté de la couche centrale à l'opposé du premier substrat. Le laminage "papier-adhésif-polymère" peut remplacer des laminages tandem de l'art antérieur fondés sur une feuille "papier-adhésif-feuille-adhésif". Un substrat de film polymère amélioré ou comparable peut remplacer les composants de la couche "feuille-adhésif" de la structure populaire de l'art antérieur.

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

Sealable packaging structures and applications related thereto does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Sealable packaging structures and applications related thereto, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Sealable packaging structures and applications related thereto will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-1849706

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.