Sealing agent for photoelectric converter and photoelectric...

H - Electricity – 01 – L

Patent

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Details

H01L 31/0203 (2006.01) C08L 63/00 (2006.01) C09K 3/10 (2006.01) H01L 23/10 (2006.01) H01L 31/04 (2006.01)

Patent

CA 2613987

Disclosed is a sealing agent for photoelectric converters which enables to easily bond upper and lower conductive supporting bodies during production of a photoelectric converter while forming a sealed portion having excellent adhesion strength, moisture resistance reliability, flexibility and the like. Specifically, a photocuring and thermosetting resin composition containing an epoxy resin (a), a thermosetting agent (b), an epoxy(meth)acrylate (c) and a photopolymerization initiator (d), and additionally if necessary, a filler (e), a silane coupling agent (f) and an ion capturing agent (g) is used as a sealing agent for photoelectric converters.

L~invention concerne un agent d~étanchéité pour convertisseurs photoélectriques permettant de coller facilement des corps supports conducteurs supérieur et inférieur pendant la fabrication d~un convertisseur photoélectrique tout en formant une portion étanche ayant une excellente force d~adhérence, une grande fiabilité de résistance à l~humidité, une grande flexibilité et similaires. Spécifiquement, une composition de résine de photovulcanisation et de thermodurcissement contenant une résine d~époxy (a), un agent de thermodurcissement (b), un (méth)acrylate époxy (c) et un initiateur de photopolymérisation (d), et en outre si nécessaire, une matière de remplissage (e), un agent de couplage silane (f) et un agent de capture ionique (g), sert d~agent d~étanchéité pour convertisseurs photoélectriques.

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