Sealing and retaining bushing for injection molding

Details Sealing and retaining bushing for injection molding Sealing and retaining bushing for injection molding

B - Operations, Transporting

29

C

18/702

B29C 45/20 (2006.01) B29C 45/28 (2006.01)

Patent

CA 1252969

ABSTRACT OF THE DISCLOSURE This invention relates to sealing and support bushings which are located between the manifold and the mold back plate to encircle each valve pin in a multi-cavity valve gated injection molding system. Each bushing is bolted through the manifold to a respective heated nozzle with central bores in alignment to receive the valve pin ltherethrough. The bushing has an outer flanged portion which extends to contact the mold back plate and forms a leakage containment chamber between them. Thus, the bushings retain the manifold in place, seal against substantial melt leakage around the reciprocating valve pins and collect any melt which does escape to prevent it entering the insulative air space between the hot manifold and the cooled mold back plate. Location of the bushing between the manifold and the mold back plate also enables the use of a standard manifold having longitudinal and transverse bores without requiring diagonal bores.

520519

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