H - Electricity – 01 – L
Patent
H - Electricity
01
L
H01L 21/56 (2006.01) B29C 45/14 (2006.01) H01L 21/00 (2006.01) H01L 21/54 (2006.01) H01L 23/24 (2006.01) H01L 23/28 (2006.01) H01L 23/29 (2006.01) H01L 23/31 (2006.01) H01L 31/0203 (2006.01)
Patent
CA 2147537
Abstract An arrangement for overmolding an article which extends beyond the mold cavity itself is provided with first and second mold portions arranged on opposing sides of a first portion of the article, which is contained within the mold cavity. A portion of deformable material is disposed in the region where the mold halves interface with a second portion of the article, which extends beyond the mold cavity. When the mold halves are clamped down in a conventional manner the deformable material forms a seal in the area of the second portion of the article which prevents the molding compound, which is injected into the mold cavity under pressure, from escaping in the vicinity of the second portion of the article. This arrangement is particularly adaptable to molding integrated circuits of the type which are installed on leadframes which extend beyond the mold cavity. Similarly, the arrangement can be used to overmold optical devices which have optical conduits extending beyond an overmolded portion. - 10 -
At&t Corp.
Kirby Eades Gale Baker
LandOfFree
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