Sealing materials for ceramic envelopes

Details Sealing materials for ceramic envelopes Sealing materials for ceramic envelopes

H - Electricity

01

J

313/162, 261/20

H01J 61/36 (2006.01) C04B 35/50 (2006.01) C04B 37/00 (2006.01) C04B 37/02 (2006.01)

Patent

CA 1095537

ABSTRACT OF THE DISCLOSURE New sealant compositions for sealing end closures or inleads in ceramic envelopes are based on the system Dy2O3-Al2O3-SiO2. These compositions will withstand metal halides used as arc materials up to temperature exceeding 1200°C, and make possible more efficient lamps of improved color rendition.

302646

Affiliated with

Also associated with

Rating

Sealing materials for ceramic envelopes does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Sealing materials for ceramic envelopes, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Sealing materials for ceramic envelopes will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-826434