Sealing method for electrical component

Details Sealing method for electrical component Sealing method for electrical component

H - Electricity

01

H

347/12

H01H 9/00 (2006.01) H05K 5/00 (2006.01) H01H 50/02 (2006.01)

Patent

CA 1122688

Abstract of the Disclosure A method is indicated to seal a bipartite housing and/or the terminal openings of an electrical compo- nent, especially of a miniature relay. The sealing is performed by pouring it out with a casting resin, but which resin is not poured out over the total sur- face but is led by grooves of small cross-sections from a dosing point to the gap of the housing and/or the terminal openings, the small cross-section of the grooves causing a capillary action. This results in a small amount of casting resin thus in a quick hardening of the resin and there is no'additional height needed for the sealing.

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