Sealing porous electronic substrates

Details Sealing porous electronic substrates Sealing porous electronic substrates

H - Electricity

01

L

H01L 23/29 (2006.01) C04B 41/50 (2006.01) C04B 41/87 (2006.01) H01L 21/48 (2006.01) H05K 1/03 (2006.01) H05K 3/00 (2006.01)

Patent

CA 2100277

SEALING POROUS ELECTRONIC SUBSTRATES ABSTRACT The present invention relates to a novel methods for sealing porous ceramic substrates. The method comprises impregnating the substrate with a silicon-containing material and then converting the material to a ceramic. The resultant substrates are resistant to moisture penetration and can be easily manipulated without damage.

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