Sealing procedures for metal and/or anodised metal substrates

Details Sealing procedures for metal and/or anodised metal substrates Sealing procedures for metal and/or anodised metal substrates

C - Chemistry, Metallurgy

23

C

C23C 22/34 (2006.01) C23C 22/53 (2006.01) C23C 22/54 (2006.01) C23C 22/56 (2006.01) C23C 22/57 (2006.01) C25D 11/04 (2006.01) C25D 11/18 (2006.01) C25D 11/30 (2006.01) C25D 11/34 (2006.01) C25D 13/06 (2006.01) C25D 13/08 (2006.01)

Patent

CA 2296539

A method of polymer sealing an anodised or unanodised surface (whether of pure metal or an alloy) having a content of at least one of the group consisting of magnesium, beryllium, titanium, zirconium, hafnium, zinc and aluminium which involves a preliminary treatment with a deactivating agent (e.g.: HF in some cases) to render the surface to be sealed substantially devoid of ionisable species and thereafter electrophoretically treating the deactivated surface with a resin suspension to provide a coating which is subsequently cured to its polymer. The procedure has particular application to magnesium and magnesium alloys and to fabricated structures thereof with, for example, aluminium or aluminium alloys.

L'invention concerne un procédé de scellement, par polymérisation, d'une surface anodisée ou non anodisée (en métal pur ou en alliage) renfermant au moins l'un des métaux suivants : magnésium, béryllium, titane, zirconium, hafnium, zinc et aluminium. Le procédé consiste à effectuer un traitement préliminaire par le biais d'un agent de désactivation (par exemple, acide fluorhydrique dans certains cas) pour rendre la surface à sceller sensiblement dépourvue de matériaux ionisables, puis à traiter par électrophorèse la surface désactivée au moyen d'une supension de résine pour établir un revêtement qui est ensuite polymérisé. Le procédé s'applique en particulier au magnésium et aux alliages à magnésium ainsi qu'aux structures à base de ce métal et de ses alliages renfermant par exemple de l'aluminium ou des alliages d'aluminium.

Affiliated with

Also associated with

Rating

Sealing procedures for metal and/or anodised metal substrates does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Sealing procedures for metal and/or anodised metal substrates, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Sealing procedures for metal and/or anodised metal substrates will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1750873