Sealing to a metal part having a copper surface

Details Sealing to a metal part having a copper surface Sealing to a metal part having a copper surface

H - Electricity

03

K

356/109, 356/116

H03K 3/00 (2006.01) C03C 27/04 (2006.01) H03K 5/06 (2006.01)

Patent

CA 1041224

ABSTRACT: Bonding a metal part having a copper surface to glass, in particular a semiconductor device of the whiskerless type. A small quantity of Cr2O3 or CuO is added to the glass. The copper is oxidized at a relatively low temperature and relatively low oxygen pressure and thereafter sealing-in is performed in a non-oxidizing atmosphere.

241819

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