Seed and method and epitaxial solidification

Details Seed and method and epitaxial solidification Seed and method and epitaxial solidification

C - Chemistry, Metallurgy

30

B

148/1.2

C30B 21/00 (2006.01) B22D 27/04 (2006.01) C30B 11/00 (2006.01) C30B 11/14 (2006.01) C30B 17/00 (2006.01)

Patent

CA 1142840

SEED AND METHOD FOR EPITAXIAL SOLIDIFICATION ABSTRACT A seed and method for epitaxial solidification of materials, a preferred seed having at least a portion with a melting point 20-45°C depressed from that of the alloy being solidified into an article. Boron and silicon are preferably added to nickel superalloys seeds when direc- tionally solidified columnar grain and single crystal articles are formed. Improved seeds also have surface compositions which promote the dissolution of surface contamination films that interfere with epitaxy. EH-7047 - 1 -

340563

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