Selective cooling of sheet to be embossed

Details Selective cooling of sheet to be embossed Selective cooling of sheet to be embossed

B - Operations, Transporting

41

F

101/14

B41F 19/02 (2006.01) B29C 59/04 (2006.01) B41M 1/24 (2006.01) B44C 1/24 (2006.01) D06N 7/00 (2006.01)

Patent

CA 1120322

CBP-6211 SELECTIVE COOLING OF SHEET TO BE EMBOSSED Abstract of the Disclosure The process herein is used for achieving multilevel me- chanical embossing of a fused or cured wear layer in-register with a print-on and expanded foam thereunder. The expansion of the decora- tive foam and fusion of the wear layer are carried out, and then the back of the foam is cooled by wetting and liquid evaporation. The wear layer is maintained at a high temperature for embossing and is embossed with registry between the embossed pattern and the printed pattern on the foam. Just prior to embossing, selective cooling may be carried out on the back of the foam in order to selectively cool hot spots in the foam.

321583

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