Selective electroless plating of vias in vlsi devices

Details Selective electroless plating of vias in vlsi devices Selective electroless plating of vias in vlsi devices

H - Electricity

01

L

356/133, 117/77

H01L 21/288 (2006.01) H01L 21/768 (2006.01)

Patent

CA 1253037

- 13 - SELECTIVE ELECTROLESS PLATING OF VIAS IN VLSI DEVICES Abstract Selective electroless plating of cobalt or nickel is utilized to form conductive plugs in high- aspect-ratio vias in VLSI devices. Particularly good results are obtained when an active or catalytic film is formed on the via bottoms to serve as a plating base.

530946

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