Selective electroplating apparatus and method of using same

Details Selective electroplating apparatus and method of using same Selective electroplating apparatus and method of using same

C - Chemistry, Metallurgy

25

D

204/11

C25D 7/04 (2006.01) C25D 5/02 (2006.01) C25D 5/08 (2006.01)

Patent

CA 1335972

An electroplating apparatus for rapidly depositing a metal onto a selected surface of a workpiece, which appara- tus comprises an anode having an active surface with a se- lected shape to combine with the selected surface of the workpiece to define an elongated gap of at least about .050 inches, means for supporting this anode in a fixed position to define the elongated gap; solution circulating means for forcing an electroplating solution with metal cations through the gap in a generally closed path at a velocity to exchange electroplating solution in the gap at a rate of at least 25 times per minute; and, means for applying current flow between the selected workpiece surface and the active surface of the anode through the gap at a current density in excess of 2.0 amperes/in2. The invention also involves the method of using this apparatus to rapidly deposit metal, such as nickel, onto the inner cylindrical surface of a bore on a complex part such as an aircraft landing gear forging.

594585

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