Selective etching process

Details Selective etching process Selective etching process

H - Electricity

01

L

148/3.2

H01L 21/306 (2006.01) C30B 33/10 (2006.01)

Patent

CA 2023712

SELECTIVE ETCHING PROCESS Abstract An etching process is described for etching aluminum containing III-V semiconductor compounds. The etch solution contains dichromate ion in acid aqueous solution in which the acid is either phosphoric acid or sulfuric acid. The etch solution is highly selective in that it etches the aluminum containing III-V semiconductor compounds without etching significantly other III-V semiconductor compounds not containing aluminum exposed to the same etching solution. The etching process is extremely useful in fabricating a variety of III-V semiconductor devices including heterojunction bipolar transistors, heterojunction field effect transistors and self-enhanced electro optic devices,

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