G - Physics – 03 – C
Patent
G - Physics
03
C
117/64, 117/90
G03C 5/00 (2006.01) C09K 3/00 (2006.01) C23C 18/16 (2006.01) G03F 7/40 (2006.01) H05K 3/18 (2006.01) H05K 3/38 (2006.01) H05K 3/42 (2006.01)
Patent
CA 1262518
SELECTIVE METALLIZATION PROCESS, ADDITIVE METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS, AND COMPOSITION FOR USE THEREIN ABSTRACT OF THE DISCLOSURE A process for selective metallization of a sub- strate in a predetermined desired pattern, and parti- cularly for the manufacture of printed circuit boards, in which a substrate patterned in desired manner with resist material is treated with conditioning agent, adjuvant and deactivating agent preparatory to catalytic activation and electroless deposit of metal flash. By proceeding in this manner, adherent flash metal deposit is achieved on non-resist areas without encountering significant plating on resist areas. Following metal flash deposit, the resist can be easily and cleanly stripped and additional metal then built up on the flash metal.
547637
Ferrier Donald R.
Larson Gary B.
Macdermid Incorporated
Perley-Robertson Hill & Mcdougall Llp
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