Selective solder formation on printed circuit boards

Details Selective solder formation on printed circuit boards Selective solder formation on printed circuit boards

H - Electricity

05

K

356/12

H05K 3/34 (2006.01) H05K 3/06 (2006.01) H05K 3/24 (2006.01) H05K 3/10 (2006.01)

Patent

CA 1301952

SELECTIVE SOLDER FORMATION ON PRINTER CIRCUIT BOARDS Abstract Disclosed is a method of providing solder on selected portions of a printed circuit board. Solder is first electroplated over copper conductor patterns on the board by means of a first photoresist layer. After stripping the first photoresist, a second photoresist layer is laminated over the board and developed to expose selected portions of the solder. The exposed portions are selectively stripped. The copper exposed by the selective stripping is then subjected to a scrubbing while the photoresist protects the remaining solder, and the second photoresist is removed.

611477

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