Selectively depositing a metal pattern on the surface of a...

Details Selectively depositing a metal pattern on the surface of a... Selectively depositing a metal pattern on the surface of a...

B - Operations, Transporting

05

D

117/64

B05D 1/32 (2006.01) C23C 18/16 (2006.01) H05K 3/18 (2006.01)

Patent

CA 1137833

ABSTRACT OF THE DISCLOSURE The method of selectively depositing a metal pattern on the surface of a laminar film comprising a dielectric substrate having a co- extensive metallic layer and a ceramic overlayer. A desired metallic pattern may be formed on the surface of the film by applying a releaseable mask in those regions of the film surface where plating of the surface is not desired, catalyzing the unmasked regions of the film surface, removing the mask from the film surface and thereafter immersing the film in an electroless plating bath whereby only the catalyzed regions are plated with the electroless metal of the bath. The preferred film has gold intermediate layer upon which elec- troless nickel or copper pattern plating is accomplished.

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